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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad Driver
The MC10E/100E112 is a quad driver with two pairs of OR/NOR outputs from each gate, and a common, buffered enable input. Using the data inputs the device can serve as an ECL memory address fan-out driver. Using just the enable input, the device serves as a clock driver, although the MC10E/100E111 is designed specifically for this purpose, and offers lower skew than the E112. For memory address driver applications where scan capabilities are required, please refer to the E212 device.
MC10E112 MC100E112
QUAD DRIVER
* * * *
600ps Max. Propagation Delay Common Enable Input Extended 100E VEE Range of - 4.2V to - 5.46V 75k Input Pulldown Resistors
Pinout: 28-Lead PLCC (Top View)
Q3b 25 VCCO D3 D2 VEE D1 D0 EN 26 27 28 1 2 3 4 5 NC 6 7 8 Q0b 9 Q0a 10 11 Q3a 24 Q3b 23 Q3a VCCO Q2b 22 21 20 Q2a 19 18 17 16 15 14 13 12 Q2b Q2a VCC Q1b Q1a Q1b Q1a Q1a D1 Q1b Q1a Q1b Q2a D2 Q2b Q2a Function Data Inputs Enable Input True Outputs Inverting Outputs EN D3 Q2b Q3a Q3b Q3a Q3b D0 FN SUFFIX PLASTIC PACKAGE CASE 776-02
LOGIC DIAGRAM
Q0a Q0b Q0a Q0b
VCCO Q0a
Q0b VCCO
* All VCC and VCCO pins are tied together on the die.
PIN NAMES
Pin D0 - D3 EN Qna, Qnb Qna, Qnb
12/93
(c) Motorola, Inc. 1996
2-1
REV 2
MC10E112 MC100E112
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol IIH Characteristic Input HIGH Current D EN Power Supply Current 10E 100E 47 47 min typ max 200 200 56 56 47 47 min 25C typ max 200 200 56 56 47 54 min 85C typ max 200 200 mA 56 65 Unit A Condition
IEE
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol tPLH tPHL tSKEW Characteristic Propagation Delay to Output D EN Within-Device Skew Dn to Qn, Qn Qna to Qnb Rise/Fall Times 20 - 80% 275 min 200 275 typ 400 450 80 40 425 700 275 max 600 675 min 200 275 25C typ 400 450 80 40 425 700 275 max 600 675 min 200 275 85C typ 400 450 80 40 ps 425 700 max 600 675 ps 1 2 Unit ps Condition
tr tf
1. Within-device skew is defined as identical transitions on similar paths through a device. 2. Skew defined between common OR or common NOR outputs of a single gate.
MOTOROLA
2-2
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E112 MC100E112
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
0.007 (0.180) U T L -M
M
B -NY BRK
M
S
N
S S
0.007 (0.180)
T L -M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L -M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L -M T L -M
S
N N
S
H
S
0.007 (0.180)
M
T L -M
S
N
S
M
S
C
E G G1 0.010 (0.250)
S
K1 0.004 (0.100) J -TSEATING PLANE
K F VIEW S 0.007 (0.180)
M
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 -- 0.025 -- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 -- 0.020 2 10 0.410 0.430 0.040 --
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 -- 0.64 -- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 2 10 10.42 10.92 1.02 --
ECLinPS and ECLinPS Lite DL140 -- Rev 4
2-3
MOTOROLA
MC10E112 MC100E112
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-4
*MC10E112/D*
MC10E112/D ECLinPS and ECLinPS Lite DL140 -- Rev 4

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